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Interconnect Contact Probes
In Circuit Fixtures
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Probes
In Circuit Fixtures
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Smiths Interconnect Kelvin Probes
Technical Features
Device contact pitch: 0.35mm pitch and above
Operating Temperature Range: -55°C to 120°C
Device packages: BGA, WLCSP, QFN
Pin-to-pin tip distance is 0.07mm-0.14mm, depending on the pin used
Insertions: >500,000
An innovative beveled offset tip allows for tighter centers,
down to 0.25mm on the device pad
Benefits
Suited for 0.35mm pitch and above applications
Four-terminal measurement for low resistance power
and analog test
Ease of maintenance
Excellent signal integrity
Self-cleaning top plunger design
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