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Smiths Interconnect Volta Probe Head
Features
Proprietary engineered plastic and machined ceramic for improved planarity allowing increased site-to-site test parallelism
Customized footprint with component clearance close to the Device Under Test (DUT)
Probe Head to PCB alignment by guide pins with optional fiducials
Lid design options include individual spring-loaded device plungers and floating device guide
Easy maintenance and quick installation
Field repairable
Compatible with industry-standard interval cleaning
Benefits
Long product life
Increased test throughput
Higher signal integrity performance
Reduced test set-up time
Lower cost of ownership
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