Technical Features

• Device contact pitch: 0.35mm pitch and above
• Operating Temperature Range: -55°C to 120°C
• Device packages: BGA, WLCSP, QFN
• Pin-to-pin tip distance is 0.07mm-0.14mm, depending on the pin used
• Insertions: >500,000
• An innovative beveled offset tip allows for tighter centers,
  down to 0.25mm on the device pad

Benefits

• Suited for 0.35mm pitch and above applications
• Four-terminal measurement for low resistance power
  and analog test
• Ease of maintenance
• Excellent signal integrity
• Self-cleaning top plunger design